Manufacturing process of double-sided tin plate/gold plate:

Cutting ------ drilling ------ copper sinking ------ circuit ------ electric drawing ------ etching ------ solder resistance ------ characters ------ tin spraying (or gold sinking) ------ gong edge ------ v cutting (some boards do not need) ------ flying test ------ vacuum packaging
Manufacturing process of double-sided gold plate:
Cutting ------ drilling ------ copper sinking ------ circuit ------ electric drawing ------ gold plating ------ etching ------ solder resistance ------ characters ------ gong edge ------ v cutting ------ flying measurement ------ vacuum packaging

Manufacturing process of multi-layer tin plate/gold plate:

Cutting ------ inner layer ------ laminating ------ drilling ------ copper sinking ------ circuit ------ diagram electricity ------ etching ------ solder resistance ------ characters ------ tin spraying (or gold sinking) ------ gong edge ------ v cutting (some boards do not need) ------ flying test ------ vacuum packaging

Manufacturing process of multilayer gold-plated plate:

Cutting ------ inner layer ------ laminating ------ drilling ------ copper sinking ------ circuit ------ electric drawing ------ gold plating ------ etching ------ solder resistance ------ characters ------ gong edge ------ v cutting ------ flying test ------ vacuum packaging